Roll to Roll (R2R) Bonder System

Micro and Nano Systems Laboratory

        

Bonding and Packaging Nano-bonding and Interconnect System Plasma Surface Activated Bonder Ultrasonic Bonder Manual Aligner Automatic Dicing Saw Wafer-Level Chemical Mechanical Polisher MultiPrep Polishing System (Chip-level CMP) Roll-to-Roll (R2R) Bonder Pick and Place System